Legal Representation
Attorney
Susan L Crockett
USPTO Deadlines
Application History
18 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| May 9, 2005 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| May 9, 2005 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Sep 2, 2004 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Sep 2, 2004 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Sep 2, 2004 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Mar 2, 2004 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Dec 9, 2003 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Nov 19, 2003 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Oct 3, 2003 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Sep 19, 2003 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Aug 13, 2003 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Aug 12, 2003 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Jun 25, 2003 | CFIT | O | CASE FILE IN TICRS | Loading... |
| Apr 10, 2003 | I | PAPER RECEIVED | Loading... | |
| May 26, 2003 | GNSL | S | LETTER OF SUSPENSION E-MAILED | Loading... |
| Apr 10, 2003 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Oct 10, 2002 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Sep 23, 2002 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 007
Semiconductor wafer processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Pseudo Mark
INTEGRITY
Classification
International Classes
007