PSR-4000 AUS

Serial Number 77465421
Registration 3683992
800

Registration Progress

Application Filed
May 5, 2008
Under Examination
Jan 20, 2009
Approved for Publication
Oct 8, 2008
Published for Opposition
Oct 28, 2008
Registered
Sep 15, 2009

Trademark Image

PSR-4000 AUS

Basic Information

Serial Number
77465421
Registration Number
3683992
Filing Date
May 5, 2008
Registration Date
September 15, 2009
Published for Opposition
October 28, 2008
Renewal Date
September 15, 2019
Drawing Code
4

Status Summary

Current Status
Active
Status Code
800
Status Date
Jul 3, 2019
Registration
Registered
Classes
002 017

Rights Holder

TAIYO HOLDINGS CO., LTD.

03
Address
2-7-1, HAZAWA, NERIMA-KU
TOKYO 176-8508
JP

Ownership History

TAIYO INK MFG. CO., LTD.

Original Applicant
03
Tokyo JP

TAIYO INK MFG. CO., LTD.

Owner at Publication
03
Tokyo JP

TAIYO INK MFG. CO., LTD.

Original Registrant
03
Tokyo JP

TAIYO HOLDINGS CO., LTD.

New Owner After Registration #1
03
TOKYO JP

Legal Representation

Attorney
Sang Eun Lee

USPTO Deadlines

Next Deadline
1406 days remaining
Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2009-09-15)
Due Date
September 15, 2029
Grace Period Ends
March 15, 2030

Application History

50 events
Date Code Type Description Documents
Jun 23, 2021 EWAF I TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS Loading...
Jun 23, 2021 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Jun 23, 2021 CHAN I APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED Loading...
Jun 23, 2021 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Jun 23, 2021 COAR I TEAS CHANGE OF OWNER ADDRESS RECEIVED Loading...
Jun 23, 2021 ECDR I TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS Loading...
Jun 23, 2021 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Feb 4, 2021 EWAF I TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS Loading...
Feb 4, 2021 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Feb 4, 2021 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Feb 4, 2021 ECDR I TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS Loading...
Feb 4, 2021 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Jul 3, 2019 NA89 E NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED Loading...
Jul 3, 2019 89AG O REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED Loading...
Jul 3, 2019 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Jul 3, 2019 RNL1 Q REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) Loading...
May 24, 2019 E89R I TEAS SECTION 8 & 9 RECEIVED Loading...
Sep 15, 2018 REM2 E COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED Loading...
May 2, 2015 NA85 E NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED Loading...
May 2, 2015 C15A O REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. Loading...
May 2, 2015 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Apr 21, 2015 E815 I TEAS SECTION 8 & 15 RECEIVED Loading...
Feb 21, 2013 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Aug 2, 2012 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Aug 2, 2012 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Jun 6, 2012 ASGN I AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Loading...
Mar 2, 2010 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Sep 15, 2009 R.PR A REGISTERED-PRINCIPAL REGISTER Loading...
Aug 11, 2009 REGV O LAW OFFICE REGISTRATION REVIEW COMPLETED Loading...
Aug 7, 2009 CNPR P ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Loading...
Jul 17, 2009 EX1G S SOU EXTENSION 1 GRANTED Loading...
Jul 17, 2009 SUPC I STATEMENT OF USE PROCESSING COMPLETE Loading...
Jul 17, 2009 CORV P REVIEW OF CORRESPONDENCE COMPLETE Loading...
Jul 16, 2009 FAXX I FAX RECEIVED Loading...
Jul 16, 2009 EXT1 S SOU EXTENSION 1 FILED Loading...
Jul 16, 2009 IUAF S USE AMENDMENT FILED Loading...
Jun 11, 2009 AITU A CASE ASSIGNED TO INTENT TO USE PARALEGAL Loading...
May 15, 2009 MAIL I PAPER RECEIVED Loading...
Jan 20, 2009 NOAM O NOA MAILED - SOU REQUIRED FROM APPLICANT Loading...
Oct 28, 2008 PUBO A PUBLISHED FOR OPPOSITION Loading...
Oct 8, 2008 NPUB O NOTICE OF PUBLICATION Loading...
Sep 23, 2008 PREV O LAW OFFICE PUBLICATION REVIEW COMPLETED Loading...
Sep 22, 2008 ALIE A ASSIGNED TO LIE Loading...
Sep 22, 2008 XAEC I EXAMINER'S AMENDMENT ENTERED Loading...
Sep 22, 2008 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Sep 22, 2008 CNEA R EXAMINERS AMENDMENT -WRITTEN Loading...
Sep 22, 2008 CNEA F EXAMINER'S AMENDMENT MAILED Loading...
Sep 2, 2008 ZZZX Z PREVIOUS ALLOWANCE COUNT WITHDRAWN Loading...
Aug 22, 2008 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Aug 19, 2008 DOCK D ASSIGNED TO EXAMINER Loading...

Detailed Classifications

Class 002
Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, and solder resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, plastic package substrate alkaline developable solder resist inks, plastic package substrate solder resist inks, package substrate solder resist inks, alkaline developable solder resist inks, CSP developable solder resist inks, and BGA developable solder resist inks; Chemicals for use in the process of producing printed circuit boards, namely, solder resist inks, and marking inks
First Use Anywhere: Jan 1, 1998
First Use in Commerce: Jan 1, 2000
Class 017
Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating plugging material for use in filling holes in the manufacture of printed circuit boards; and insulating solder mask for use in the process of producing printed circuit boards, namely, solder resist dry films, plastic package substrate alkaline developable resist dry films, plastic package substrate solder resist dry films, package substrate solder resist dry films, and alkaline developable solder resist dry films
First Use Anywhere: Jan 1, 1998
First Use in Commerce: Jan 1, 2000

Classification

International Classes
002 017