HY-BOND

Serial Number 76556100
602

Registration Progress

Application Filed
Oct 16, 2003
Under Examination
Approved for Publication
Published for Opposition
Registered

Trademark Image

HY-BOND

Basic Information

Serial Number
76556100
Filing Date
October 16, 2003
Abandonment Date
November 3, 2004
Drawing Code
5000

Status Summary

Current Status
Inactive
Status Code
602
Status Date
Dec 30, 2004
Classes
005

Rights Holder

SHOFU, INC.

03
Address
11 Kamitakamatsu-cho, Fukuine
Higashiyama-ku, Kyoto 605
JP

Ownership History

SHOFU, INC.

Original Applicant
03
Higashiyama-ku, Kyoto 605 JP

Legal Representation

Attorney
YOSHIO KATAYAMA

USPTO Deadlines

No Upcoming Deadlines

No upcoming deadlines found for this trademark.

Application History

6 events
Date Code Type Description Documents
Dec 30, 2004 ABN2 O ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Loading...
Dec 30, 2004 MAB2 O ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND Loading...
Dec 23, 2004 DOCK D ASSIGNED TO EXAMINER Loading...
May 3, 2004 CNRT F NON-FINAL ACTION MAILED Loading...
May 2, 2004 DOCK D ASSIGNED TO EXAMINER Loading...
Nov 19, 2003 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 005
Dental Material-namely, Dental Cement for Bonding Purposes
First Use Anywhere: Feb 4, 1987
First Use in Commerce: Feb 4, 1987

Additional Information

Pseudo Mark
HY-BOND

Classification

International Classes
005