Legal Representation
Attorney
ADAM C. VOLENTINE
USPTO Deadlines
Application History
15 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Sep 2, 2005 | UNDC | O | UNDELIVERABLE MAIL - COURTESY COPY MAILED | Loading... |
| Aug 5, 2005 | I | PAPER RECEIVED | Loading... | |
| Aug 1, 2005 | I | PAPER RECEIVED | Loading... | |
| Aug 1, 2005 | MAB2 | O | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND | Loading... |
| Aug 1, 2005 | ABN2 | O | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | Loading... |
| Jan 3, 2005 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| Dec 30, 2004 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Dec 9, 2004 | ACEC | I | AMENDMENT FROM APPLICANT ENTERED | Loading... |
| Nov 29, 2004 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 29, 2004 | I | PAPER RECEIVED | Loading... | |
| May 20, 2004 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| Mar 12, 2004 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Mar 12, 2004 | I | PAPER RECEIVED | Loading... | |
| Sep 15, 2003 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Aug 25, 2003 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 007
Plasma or Reactive Ion Etching machines, Sputtering machines, evaporators, plating machines, machines for handling and storing semiconductor wafers
First Use Anywhere:
19920700
First Use in Commerce:
19920700
Classification
International Classes
007