Legal Representation
Attorney
ROBERT W. BECKER
USPTO Deadlines
Application History
10 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jan 6, 2003 | ABN1 | O | ABANDONMENT - EXPRESS MAILED | Loading... |
| Dec 13, 2002 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Nov 21, 2002 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Jul 8, 2002 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Jul 3, 2002 | CNFR | O | FINAL REFUSAL MAILED | Loading... |
| Nov 21, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| May 22, 2001 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| May 7, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| May 7, 2001 | 1.BD | I | Sec. 1(B) CLAIM DELETED | Loading... |
| May 7, 2001 | UNPR | I | UNRESPONSIVE/DUPLICATE PAPER RECEIVED | Loading... |
Detailed Classifications
Class 007
Machines for manufacturing semiconductor substrates, silicon chips, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips and solar cells; machines for drying, cleaning or etching silicon wafers for use in the in the manufacture of semiconductor chips; wet processing machines for use manufacture of semiconductor chips and wet processing machines for oxidation by diluted hydrofluoric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and machine parts, namely, drying units using nitrogen, alcohol vapors or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, and solar cells
First Use Anywhere:
0
First Use in Commerce:
0
Class 011
Drying and wet processing units for the treatment of semiconductor substrates, silicon chips, wafers, liquid crystal substrates, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces
First Use Anywhere:
0
First Use in Commerce:
0
Class 037
Installation and servicing of the following machines and units, machines for manufacturing semiconductor substrates, silicon chips, wafers, liquid crystal display substrates, liquid crystal displays, semiconductor chips, and/or solar cells, machines for drying, cleaning and/or etching silicon wafers for use in the manufacture of semiconductor chips; wet processing machines for use in the manufacture of semiconductor chips and wet processing machines for oxidation by diluted hydrofluoric and hydrochloric acid and for particle removal in an ammonia and hydrogen peroxide acid bath, all for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells; and drying units using nitrogen, alcohol vapors and/or mixtures thereof for use on semiconductor substrates and wafers, silicon wafers, liquid crystal display substrates, liquid crystal displays, solar cells, as machine parts; drying and wet processing units for the treatment of semiconductor substrates, silicon chips wafers, liquid crystal displays, semiconductor wafers and solar cells as well as their surfaces
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
007
011
037