Legal Representation
Attorney
Stephen J. Holmes
USPTO Deadlines
Application History
24 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Sep 27, 2005 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Sep 27, 2005 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| Nov 1, 2004 | EX4G | S | SOU EXTENSION 4 GRANTED | Loading... |
| Oct 7, 2004 | I | PAPER RECEIVED | Loading... | |
| Oct 1, 2004 | EXT4 | S | SOU EXTENSION 4 FILED | Loading... |
| Apr 19, 2004 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
| Apr 14, 2004 | CFIT | O | CASE FILE IN TICRS | Loading... |
| Mar 29, 2004 | I | PAPER RECEIVED | Loading... | |
| Mar 25, 2004 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
| Sep 17, 2003 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
| Sep 10, 2003 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Sep 10, 2003 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
| Mar 24, 2003 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Feb 12, 2003 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Feb 12, 2003 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Oct 1, 2002 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jul 9, 2002 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 19, 2002 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Mar 12, 2002 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Dec 10, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Dec 3, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Jun 1, 2001 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| May 19, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| May 3, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 001
Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component assemblies
First Use Anywhere:
0
First Use in Commerce:
0
Class 003
cleaning materials for use in removing flux residues from soldered assemblies
First Use Anywhere:
0
First Use in Commerce:
0
Class 006
industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Other
The drawing is lined for the colors blue and yellow, but color is not a feature of the mark.
Pseudo Mark
BLUE LINE
Classification
International Classes
001
003
006