Legal Representation
Attorney
Curtis B Hamre
USPTO Deadlines
Application History
32 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Nov 21, 2005 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Nov 21, 2005 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| Apr 9, 2005 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
| Mar 16, 2005 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Mar 16, 2005 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
| Sep 20, 2004 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
| Sep 9, 2004 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Sep 9, 2004 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
| Aug 17, 2004 | CFIT | O | CASE FILE IN TICRS | Loading... |
| Apr 26, 2004 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Mar 25, 2004 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Mar 15, 2004 | I | PAPER RECEIVED | Loading... | |
| Mar 12, 2004 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Sep 16, 2003 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jun 24, 2003 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 4, 2003 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Apr 12, 2003 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Apr 1, 2003 | FAXX | I | FAX RECEIVED | Loading... |
| Mar 13, 2003 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| Mar 12, 2003 | ZZZX | Z | PREVIOUS ALLOWANCE COUNT WITHDRAWN | Loading... |
| Mar 3, 2003 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jan 13, 2003 | I | PAPER RECEIVED | Loading... | |
| Jan 8, 2003 | ZZZX | Z | PREVIOUS ALLOWANCE COUNT WITHDRAWN | Loading... |
| Jan 8, 2003 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 12, 2002 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jul 15, 2002 | I | PAPER RECEIVED | Loading... | |
| Jul 15, 2002 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Feb 11, 2002 | CNFR | O | FINAL REFUSAL MAILED | Loading... |
| Nov 9, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| May 11, 2001 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| May 8, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Apr 30, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 009
Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units
First Use Anywhere:
0
First Use in Commerce:
0
Class 037
Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; repair and maintenance of data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Other
The stippling shown in the drawing is a feature of the mark.
Classification
International Classes
009
037