Legal Representation
Attorney
Curtis B Hamre
USPTO Deadlines
Application History
31 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Jun 27, 2006 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
Jun 27, 2006 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
Sep 8, 2005 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Sep 8, 2005 | EXT5 | S | SOU EXTENSION 5 FILED | Loading... |
Sep 8, 2005 | EX5G | S | SOU EXTENSION 5 GRANTED | Loading... |
Mar 18, 2005 | EX4G | S | SOU EXTENSION 4 GRANTED | Loading... |
Feb 28, 2005 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Feb 28, 2005 | EXT4 | S | SOU EXTENSION 4 FILED | Loading... |
Oct 29, 2004 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
Oct 20, 2004 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Oct 20, 2004 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
Aug 11, 2004 | CFIT | O | CASE FILE IN TICRS | Loading... |
May 4, 2004 | DPCC | D | DIVISIONAL PROCESSING COMPLETE | Loading... |
May 4, 2004 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
Apr 26, 2004 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Apr 23, 2004 | I | PAPER RECEIVED | Loading... | |
Apr 23, 2004 | DRRR | I | DIVISIONAL REQUEST RECEIVED | Loading... |
Apr 20, 2004 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
Nov 10, 2003 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
Oct 14, 2003 | I | PAPER RECEIVED | Loading... | |
Oct 14, 2003 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
Apr 22, 2003 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
Jan 28, 2003 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
Jan 8, 2003 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
Nov 25, 2002 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
Jul 15, 2002 | I | PAPER RECEIVED | Loading... | |
Jul 15, 2002 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Feb 5, 2002 | CNFR | O | FINAL REFUSAL MAILED | Loading... |
Oct 11, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Apr 11, 2001 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
Mar 29, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 036
Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere:
0
First Use in Commerce:
0
Class 037
Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere:
0
First Use in Commerce:
0
Class 040
Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
036
037
040