ACCRETECH

Serial Number 76182002
606

Registration Progress

Application Filed
Dec 15, 2000
Under Examination
Apr 22, 2003
Approved for Publication
Jan 8, 2003
Published for Opposition
Jan 28, 2003
Registered

Trademark Image

ACCRETECH

Basic Information

Serial Number
76182002
Filing Date
December 15, 2000
Published for Opposition
January 28, 2003
Abandonment Date
April 23, 2006
Drawing Code
1000

Status Summary

Current Status
Inactive
Status Code
606
Status Date
Apr 23, 2006
Classes
036 037 040

Rights Holder

Kabushiki Kaisha Tokyo Seimitsu

03
Address
9-7-1, Shimorenjaku
Mitaka-shi
Tokyo
JP

Ownership History

Kabushiki Kaisha Tokyo Seimitsu

Original Applicant
03
Tokyo JP

Kabushiki Kaisha Tokyo Seimitsu

Owner at Publication
03
Tokyo JP

Legal Representation

Attorney
Curtis B Hamre

USPTO Deadlines

All Deadlines Cleared

All 4 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

31 events
Date Code Type Description Documents
Jun 27, 2006 ABN6 S ABANDONMENT - NO USE STATEMENT FILED Loading...
Jun 27, 2006 MAB6 O ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED Loading...
Sep 8, 2005 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Sep 8, 2005 EXT5 S SOU EXTENSION 5 FILED Loading...
Sep 8, 2005 EX5G S SOU EXTENSION 5 GRANTED Loading...
Mar 18, 2005 EX4G S SOU EXTENSION 4 GRANTED Loading...
Feb 28, 2005 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Feb 28, 2005 EXT4 S SOU EXTENSION 4 FILED Loading...
Oct 29, 2004 EX3G S SOU EXTENSION 3 GRANTED Loading...
Oct 20, 2004 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Oct 20, 2004 EXT3 S SOU EXTENSION 3 FILED Loading...
Aug 11, 2004 CFIT O CASE FILE IN TICRS Loading...
May 4, 2004 DPCC D DIVISIONAL PROCESSING COMPLETE Loading...
May 4, 2004 EX2G S SOU EXTENSION 2 GRANTED Loading...
Apr 26, 2004 DOCK D ASSIGNED TO EXAMINER Loading...
Apr 23, 2004 MAIL I PAPER RECEIVED Loading...
Apr 23, 2004 DRRR I DIVISIONAL REQUEST RECEIVED Loading...
Apr 20, 2004 EXT2 S SOU EXTENSION 2 FILED Loading...
Nov 10, 2003 EX1G S SOU EXTENSION 1 GRANTED Loading...
Oct 14, 2003 MAIL I PAPER RECEIVED Loading...
Oct 14, 2003 EXT1 S SOU EXTENSION 1 FILED Loading...
Apr 22, 2003 NOAM O NOA MAILED - SOU REQUIRED FROM APPLICANT Loading...
Jan 28, 2003 PUBO A PUBLISHED FOR OPPOSITION Loading...
Jan 8, 2003 NPUB O NOTICE OF PUBLICATION Loading...
Nov 25, 2002 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Jul 15, 2002 MAIL I PAPER RECEIVED Loading...
Jul 15, 2002 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Feb 5, 2002 CNFR O FINAL REFUSAL MAILED Loading...
Oct 11, 2001 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Apr 11, 2001 CNRT F NON-FINAL ACTION MAILED Loading...
Mar 29, 2001 DOCK D ASSIGNED TO EXAMINER Loading...

Detailed Classifications

Class 036
Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere: 0
First Use in Commerce: 0
Class 037
Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere: 0
First Use in Commerce: 0
Class 040
Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
First Use Anywhere: 0
First Use in Commerce: 0

Classification

International Classes
036 037 040