Legal Representation
Attorney
Curtis B. Hamre
USPTO Deadlines
Application History
30 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Apr 11, 2006 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Apr 11, 2006 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| Aug 8, 2005 | EX5G | S | SOU EXTENSION 5 GRANTED | Loading... |
| Jul 29, 2005 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Jul 29, 2005 | EXT5 | S | SOU EXTENSION 5 FILED | Loading... |
| Feb 18, 2005 | DPCC | D | DIVISIONAL PROCESSING COMPLETE | Loading... |
| Feb 18, 2005 | EX4G | S | SOU EXTENSION 4 GRANTED | Loading... |
| Jan 31, 2005 | I | PAPER RECEIVED | Loading... | |
| Jan 31, 2005 | DRRR | I | DIVISIONAL REQUEST RECEIVED | Loading... |
| Jan 31, 2005 | EXT4 | S | SOU EXTENSION 4 FILED | Loading... |
| Sep 3, 2004 | I | PAPER RECEIVED | Loading... | |
| Aug 26, 2004 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
| Aug 9, 2004 | I | PAPER RECEIVED | Loading... | |
| Aug 4, 2004 | CFIT | O | CASE FILE IN TICRS | Loading... |
| Aug 4, 2004 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
| Feb 6, 2004 | I | PAPER RECEIVED | Loading... | |
| Feb 3, 2004 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
| Feb 3, 2004 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
| Oct 24, 2003 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Aug 4, 2003 | I | PAPER RECEIVED | Loading... | |
| Aug 4, 2003 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Feb 4, 2003 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Nov 12, 2002 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Oct 23, 2002 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Mar 14, 2002 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jan 10, 2002 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Aug 1, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Feb 2, 2001 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Jan 26, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 24, 2001 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 007
Semiconductor manufacturing equipment, namely, semiconductor wafer scrubbing and washing machine, wire slicing machine, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon emounting and cleaning machine, wafer probing machine, and chemical mechanical planarizers
First Use Anywhere:
0
First Use in Commerce:
0
Class 009
Precision measuring machines, namely, wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, contour measuring machine, coordinate measuring machines; data processing for coordinate measuring machines, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring instrument, namely, electric current or voltage detectors, magnetic measuring apparatus, namely, magnetic sensors, capacity measures; optical apparatus, namely, microscopes; electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders; automatic distribution vending machines; network system comprised of computer hardware and software for wafer probing machines; wafer inspection units
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
007
009