Legal Representation
Attorney
Douglas H. Goldhush
USPTO Deadlines
Application History
15 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Apr 10, 2003 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Apr 10, 2003 | ABN1 | O | ABANDONMENT - EXPRESS MAILED | Loading... |
| Oct 17, 2002 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| Oct 16, 2002 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 19, 2002 | SUPC | I | STATEMENT OF USE PROCESSING COMPLETE | Loading... |
| Sep 19, 2002 | IUAF | S | USE AMENDMENT FILED | Loading... |
| Sep 19, 2002 | I | PAPER RECEIVED | Loading... | |
| Apr 16, 2002 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jan 22, 2002 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jan 2, 2002 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Oct 4, 2001 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jun 14, 2001 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Dec 14, 2000 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Nov 29, 2000 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Nov 28, 2000 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 001
ETCHING RESIST, PLATING RESIST, SOLDER RESIST, FILING RESIN USED FOR MANUFACTURING PRINTED CIRCUIT BOARD; PHOTOSENSITIVE DRY FILMS FOR USE IN THE MANUFACTURE OF PRINTED CIRCUITS, NAMELY, DRY FILM PHOTORESIST; AND PHOTOSENSITIVE CHEMICALS, NAMELY, LIQUID PHOTOIMAGEABLE SOLDER RESIST, AND ELECTRODEPOSITED PHOTORESIST
First Use Anywhere:
Aug 12, 2000
First Use in Commerce:
Aug 12, 2000
Classification
International Classes
001