Legal Representation
Attorney
Curtis B. Hamre
Detailed Classifications
Class 007
Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing apparatus; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, network system for wafer probing machine, chemical mechanical planarizers
First Use Anywhere:
Apr 6, 2001
First Use in Commerce:
Apr 16, 2001
Class 009
Precision measuring machines, namely, non-contact flatness measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three dimensional measuring machine, coordinate measuring machine; data processing for coordinate measuring machines,displacement sensor, computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measurers; Optical apparatus/instruments, namely microscopes; electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines
First Use Anywhere:
Apr 15, 2001
First Use in Commerce:
Apr 20, 2001
Additional Information
Other
The lining is a feature of the mark and does not indicate color.
Classification
International Classes
007
009