Legal Representation
Attorney
Randy W. Tung
USPTO Deadlines
Application History
15 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Feb 4, 2004 | ABN2 | O | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | Loading... |
| Jun 18, 2003 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| May 29, 2003 | CFIT | O | CASE FILE IN TICRS | Loading... |
| May 22, 2003 | SUPC | I | STATEMENT OF USE PROCESSING COMPLETE | Loading... |
| Apr 1, 2003 | IUAF | S | USE AMENDMENT FILED | Loading... |
| Apr 3, 2003 | I | PAPER RECEIVED | Loading... | |
| Oct 1, 2002 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jul 9, 2002 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 19, 2002 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Apr 10, 2002 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Sep 21, 2000 | CNSL | F | LETTER OF SUSPENSION MAILED | Loading... |
| Jun 12, 2000 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Dec 10, 1999 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Nov 18, 1999 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Nov 16, 1999 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 009
Electronic components, namely, solder bumped semiconductor silicon chips and wafers; solder bumped electronic substrates for use in the manufacture of integrated circuit devices and solder bumped circuit boards
First Use Anywhere:
Jun 22, 1999
First Use in Commerce:
Jun 22, 1999
Classification
International Classes
009