SOLDER BALL INTERPOSER

Serial Number 75719678
603

Registration Progress

Application Filed
Jun 2, 1999
Under Examination
Approved for Publication
Published for Opposition
Registered

Trademark Image

SOLDER BALL INTERPOSER

Basic Information

Serial Number
75719678
Filing Date
June 2, 1999
Abandonment Date
September 20, 2001
Drawing Code
1000

Status Summary

Current Status
Inactive
Status Code
603
Status Date
Sep 20, 2001
Classes
009

Rights Holder

NGK Spark Plug Co., Ltd.

03
Address
14-18, Takatsuji-cho, Mizuho-ku
Nagoya City
JP

Ownership History

NGK Spark Plug Co., Ltd.

Original Applicant
03
Nagoya City JP

Legal Representation

Attorney
Jeffrey A. Schwab

USPTO Deadlines

All Deadlines Cleared

All 1 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

11 events
Date Code Type Description
Feb 4, 2002 EXFB T EXPARTE APPEAL DISMISSED - FAILURE TO FILE BRIEF
Feb 4, 2002 EXPT T EXPARTE APPEAL TERMINATED
Sep 20, 2001 ABN3 O ABANDONMENT - AFTER EX PARTE APPEAL
Jul 3, 2001 CNCF O CONTINUATION OF FINAL REFUSAL MAILED
Jun 13, 2001 JURT T JURISDICTION RESTORED TO EXAMINING ATTORNEY
Jun 5, 2001 EXPI T EX PARTE APPEAL-INSTITUTED
Jan 11, 2001 CNFR O FINAL REFUSAL MAILED
May 18, 2000 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE
Nov 23, 1999 CNRT F NON-FINAL ACTION MAILED
Nov 9, 1999 DOCK D ASSIGNED TO EXAMINER
Nov 5, 1999 DOCK D ASSIGNED TO EXAMINER

Detailed Classifications

Class 009
Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board
First Use Anywhere: 0
First Use in Commerce: 0

Classification

International Classes
009