Legal Representation
Attorney
LAWRENCE E. ABELMAN
USPTO Deadlines
Application History
11 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Aug 21, 2002 | EXPT | T | EXPARTE APPEAL TERMINATED | Loading... |
| Feb 4, 2002 | EXFB | T | EXPARTE APPEAL DISMISSED - FAILURE TO FILE BRIEF | Loading... |
| Feb 4, 2002 | ABN3 | O | ABANDONMENT - AFTER EX PARTE APPEAL | Loading... |
| Jul 2, 2001 | CNCF | O | CONTINUATION OF FINAL REFUSAL MAILED | Loading... |
| Jun 6, 2001 | EXPI | T | EX PARTE APPEAL-INSTITUTED | Loading... |
| Jun 6, 2001 | JURT | T | JURISDICTION RESTORED TO EXAMINING ATTORNEY | Loading... |
| Jan 11, 2001 | CNFR | O | FINAL REFUSAL MAILED | Loading... |
| May 18, 2000 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 23, 1999 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Nov 12, 1999 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Nov 5, 1999 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Detailed Classifications
Class 009
Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board
First Use Anywhere:
Jul 1, 1996
First Use in Commerce:
Jul 1, 1996
Classification
International Classes
009