Legal Representation
Attorney
LAWRENCE E ABELMAN
USPTO Deadlines
Application History
10 events| Date | Code | Type | Description |
|---|---|---|---|
| Oct 22, 2001 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED |
| Jan 11, 2001 | EXT1 | S | SOU EXTENSION 1 FILED |
| Jan 11, 2001 | EX1G | S | SOU EXTENSION 1 GRANTED |
| Jul 25, 2000 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT |
| May 2, 2000 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Mar 31, 2000 | NPUB | O | NOTICE OF PUBLICATION |
| Mar 9, 2000 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Feb 8, 2000 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Aug 23, 1999 | CNRT | F | NON-FINAL ACTION MAILED |
| Aug 18, 1999 | DOCK | D | ASSIGNED TO EXAMINER |
Detailed Classifications
Class 009
SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; CERDIPS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; PRINTED CIRCUITS, PRINTED WIRING; MULTILAYER PRINTED CIRCUIT BOARDS
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
009
USPTO Documents
Loading USPTO documents...